Bonding Crystal

Bonding Crystal

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Common Specifications:

Size&tolerance:W(+/-0.1)*H(+/-0.1)*L(+0.5/-0.1)mm
Parallelism:≤10″
Tolerance of orientation:+/-0.25°
TWD: λ/8@633nm
Surface quality:20/10
Bevel:≤0.2mmx45
Perpendicular:≤10’
Chips: ≤0.1mm
Flatness:λ/10@633nm
CA:≥90%
Coating:C1--- AR@1064(R<0.2%)&808(R<0.5%)
Damage threshold:500MW/cm² 10ns 10Hz at 1064nm
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