343nm 대역 통과 필터

Context: A device for measuring the power density distribution of a radiation source, specifically designed for high-power lasers used in material processing.
Usage of Filter: The bandpass filter is placed in the optical path before the sensor (photodiode or CCD) and after the attenuation or beam-splitting stage.
Function: To isolate the specific 343nm UV wavelength from background noise, ambient light, or residual fundamental laser frequencies (e.g., 1030nm or 515nm) that may not have been fully converted during harmonic generation.
Result: Precise, noise-free measurement of the UV laser's power density profile, ensuring that the laser parameters meet the strict requirements for micromachining.

Context: An optical system designed for beam shaping, typically converting a Gaussian laser beam into a "Top Hat" or uniform square profile for uniform laser ablation.
Usage of Filter: The filter is utilized at the input of the beam shaping module or as part of the beam delivery optics.
Function: Diffractive Optical Elements (DOEs) used for beam shaping are highly wavelength-dependent. The filter ensures that only the design wavelength (343nm) enters the shaping optics. If broadband or incorrect wavelengths enter, the diffraction angles would change, ruining the shape of the output beam.
Result: A highly uniform, dimensionally accurate beam spot on the workpiece, preventing uneven ablation depths during manufacturing.

Context: Laser-releasable bonding materials used in semiconductor 3D packaging. A release layer (polyketanil-based) bonds a device wafer to a carrier and is "debonded" by exposure to UV laser energy.
Usage of Filter: Integrated into the laser debonding head to condition the beam before it passes through the glass carrier to strike the release layer.
Function: To transmit high-energy 343nm photons which are absorbed by the release layer (breaking the chemical bonds) while blocking heat-generating infrared wavelengths (IR).
Result: "Cold" separation of the delicate semiconductor wafer from its carrier without thermal damage or stress, leaving a clean surface for subsequent processing.