Optical Dicing (Cut big pieces into smaller pieces)

Optical dicing refers to precision cutting processes used to segment optical materials, particularly those with specialized coatings, into smaller functional components while maintaining their structural and optical integrity. In the context of optical coating flats (flat substrates like glass, fused silica, or semiconductors coated with anti-reflective, dielectric, or other optical layers), dicing ensures these coated substrates meet exact dimensional requirements for applications in photonics, lasers, sensors, and semiconductor devices.

Methods

• Saw Dicing: Diamond-coated blades for clean cuts with minimal chipping.

• Laser Dicing: Non-contact ablation for delicate or brittle materials, reducing mechanical stress.
• Plasma Dicing: Dry etching for ultra-fine features, ideal for advanced semiconductor wafers.

Price

Dicing Service will generally cost from $50 to $125 per piece. Depending on the accuracy and size you are requesting.